PLCC or PQFP to PGA Adapter

Interconnect Systems Inc.

Architecture:
Type :
Last Update:

i960(R) Processors KX
Hardware Accessories
6/26/97 11:30:00 AM

Vendor Information

Tool Description:

Interconnect Systems, Inc. has an adapter for converting a surface mount package to a through-hole (PGA) package. The i960(R) processor adapter allows the user to use the surface mount package without forcing direct fine-pitch surface mount on a large board assembly, and without any board re-design whatsoever. This is because ISI has developed an adapter design which allows existing package footprints to directly translate to each other.

Tool Features:

Installed Cost Savings Using Adapter Plus PQFP, Versus PGA - Makes Intel Chip Cost Effective For Thru-Hole Users

Adapter Plus PQFP Form and Function Compatible With Intel PGA - Use Adapter Without Any Board Design Modifications

Flexibility in Package Use - Allows Chip Users to Convert Between Different Package Styles Without Board Modification

Capability of Adapters to Provide Custom Features to Specific Chip Users - Add Power/Ground Planes, De-Coupling Capacitors, Multiple Chips, etc. While Maintain Package Footprint Compatibility

Development Platform(s):

File Attachments:

S960_158.PDF - Solutions960(R) Catalog Product Listing

Supported Device Detail Matrix:

Part & Package
Availability

80960KA - 132ldPGA
80960KA - 132ldPQFP
80960KB - 132ldPGA
80960KB - 132ldPQFP
82961KD - 132ldPQFP
82961KD - 164ldPQFP
NOW
NOW
NOW
NOW
NOW
NOW

Vendor Information:

Interconnect Systems Inc.

2162 Union Place, P.O. Box 1089
Simi Valley , CA 93065
USA
(805) 581-5626

Fax : (805) 581-5032

Contact the vendor above for the latest Distributor information

	Part & Package		Availability
	80960KA - 132ldPGA 80960KA - 132ldPQFP 80960KB - 132ldPGA 80960KB - 132ldPQFP 82961KD - 132ldPQFP 82961KD - 164ldPQFP		NOW NOW NOW NOW NOW NOW